Call for Papers
25th International Conference on Architectural Support for Programming Languages and Operating Systems
Abstract submissions August 9, 2019 (4:59:59pm PDT)
Full paper submissions August 16, 2019 (4:59:59pm PDT)
Author response October 28-November 1, 2019
Author Notification November 20, 2019
Artifact submission (optional) December 4, 2019
Final copy deadline January 20, 2020
ASPLOS is the premier forum for interdisciplinary systems research, intersecting computer architecture, hardware and emerging technologies, programming languages and compilers, operating systems, and networking. The 25th ASPLOS will be held in Lausanne, Switzerland, a beautiful town on the shores of Lake Geneva, conveniently located in the center of Europe, and at EPFL.
Like its predecessors, ASPLOS 2020 invites papers on ground-breaking research at the intersection of the ASPLOS disciplines: architecture, programming languages, operating systems, and related areas. Non-traditional topics are especially encouraged. The importance of cross-cutting research continues to increase as we grapple with the end of Dennard scaling, the explosion of big data, the scale of computing from ultra-low power wearables to exascale systems, the need for sustainability, and the growth of human-centered applications. ASPLOS embraces systems research that addresses new problems in innovative ways. Research may target diverse goals such as performance, energy and thermal efficiency, resiliency, security, privacy, sustainability, applicability to future technologies, applications, and environments. The review process will be sensitive to the challenges of multidisciplinary work and emerging areas.
Areas of interest include, but are not limited to:
- Existing and emerging platforms at all scales, from embedded to cloud
- Traditional and extreme environments, from implantable to space
- Internet services, cloud computing, and datacenters
- Multicore architectures and systems
- Heterogeneous architectures and accelerators
- Systems for enabling parallelism at an extreme scale
- Programming models, languages, and compilation for all platforms
- Managing, storing, and computing big data
- Virtualization and virtualized systems
- Memory/storage technologies and architectures
- Power, energy, and thermal management
- Security, reliability, availability, and sustainability
- Verification and testing, and their impact on design and security
- Systems and hardware support for machine learning
- Non-traditional computing systems, including emerging devices
Call for Research Artifacts
Submissions to ASPLOS often comprise far more than the paper– they include supporting materials such as code, data, models, experimental workflows or results that are crucial to evaluating the conclusions drawn in the paper. To promote the reproducibility of experimental results and to encourage authors to provide useful artifacts that help the community quickly validate and compare alternative approaches, ASPLOS 2020 includes an artifact evaluation process. We invite authors of accepted ASPLOS 2020 papers to submit their supporting materials to the Artifact Evaluation process based on the ACM Artifact Review and Badging policy, a standard for systems conferences including CGO, PLDI, PPoPP and SuperComputing.
The Artifact Evaluation process is run by a separate committee whose task is to assess how the artifacts support the work described in the papers. This submission is voluntary and will not influence the final decision regarding the papers. Please note that the artifact submission deadline is shortly after notification of the paper’s acceptance– authors should prepare in advance to ensure time for artifact assembly and documentation. Camera-ready papers that successfully go through the Artifact Evaluation process will include an Artifact Appendix and will receive a set of ACM badges printed on the camera-ready papers. Additional information is available on the ASPLOS 2020 AE web page.
- Artifact submission: December 4, 2019
- Artifact decision: January 15, 2020
- Reproducibility discussion: TBA